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UCC37324P - Texas Instruments

Description: UCC37324P, Dual MOSFET Power Driver 4.5A, Non-Inverting, 4.5 → 15 V, 8-Pin PDIP

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Symbol
UCC37324P - Texas Instruments - PCB symbol
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PCB Footprints
UCC37324P - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC37324P - Texas Instruments - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC37324P Details

  • Manufacturer Part Number:

    UCC37324P

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.81 mm

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    7.62 mm

UCC37324P Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC37324P involves keeping the input and output stages separate, using a star-ground configuration, and placing the device close to the power source. Additionally, using a 4-layer PCB with a solid ground plane and a separate power plane can help reduce EMI.
  • To ensure proper thermal management, make sure to provide adequate heat sinking, such as a thermal pad or heat sink, and ensure good airflow around the device. The thermal pad should be connected to a copper plane on the PCB to dissipate heat efficiently.
  • A recommended input filter configuration for the UCC37324P is a pi-filter (L-C-L) or a T-filter (L-C-R-L) to reduce input ripple and noise. The filter components should be chosen based on the specific application requirements and input voltage range.
  • To troubleshoot issues with the UCC37324P, start by checking the PCB layout and component placement for any potential issues. Verify that the input and output capacitors are properly sized and placed. Check the voltage and current waveforms using an oscilloscope to identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When selecting the output inductor for the UCC37324P, consider the inductor's saturation current, DC resistance, and core material. Choose an inductor with a high saturation current rating to handle the peak current requirements. The DC resistance should be low to minimize power losses. The core material should be suitable for the operating frequency and temperature range.

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UCC37324P Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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