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UCC3800PW - Texas Instruments

Description: Low-Power BiCMOS Current-Mode PWM

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UCC3800PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0008A
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UCC3800PW - Texas Instruments  - 3D model - Small Outline Packages - PW0008A
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UCC3800PW Details

  • Manufacturer Part Number:

    UCC3800PW

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    7.5 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

UCC3800PW Frequently Asked Questions (FAQs)

  • The UCC3800PW is a high-frequency device, and proper layout and placement are crucial for its operation. TI recommends placing the device close to the power stage, using short traces, and minimizing loop areas to reduce EMI. A 4-layer PCB with a solid ground plane is recommended. Additionally, decoupling capacitors should be placed close to the device's power pins.
  • The UCC3800PW's switching frequency can be adjusted by changing the value of the RT resistor connected to the RT pin. A smaller RT resistor value increases the switching frequency, while a larger value decreases it. However, be careful not to exceed the maximum recommended switching frequency to avoid increased losses and EMI.
  • The bootstrap capacitor (CBOOT) is used to generate the gate drive voltage for the high-side FET. It is charged through the bootstrap diode (DBOOT) when the low-side FET is on. The CBOOT value should be chosen to ensure that the gate drive voltage is sufficient to fully enhance the high-side FET.
  • The UCC3800PW has built-in undervoltage lockout (UVLO) protection, which disables the device when the input voltage falls below a certain threshold. For overvoltage protection, an external voltage clamp or a zener diode can be used to limit the input voltage to a safe level. Additionally, a fuse or a current limiter can be used to protect the device from overcurrent conditions.
  • Yes, the UCC3800PW can be used in a synchronous rectification topology. In this configuration, the low-side FET is used as a synchronous rectifier, and the UCC3800PW's dead-time control feature helps to minimize the body diode conduction losses. However, proper design and layout considerations are necessary to ensure reliable operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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