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UCC3802N - Texas Instruments

Description: UCC3802N, PWM Current Mode Controller, 1 A Boost, Buck, Flyback, 1000 kHz 8-Pin PDIP

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UCC3802N - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC3802N - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC3802N Details

  • Manufacturer Part Number:

    UCC3802N

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.81 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

UCC3802N Frequently Asked Questions (FAQs)

  • The UCC3802N is a high-frequency device, and proper layout and placement are crucial to minimize EMI and ensure reliable operation. TI recommends placing the device close to the power stage, using a solid ground plane, and keeping the high-frequency loops as small as possible. Additionally, it's essential to follow good PCB design practices, such as using a multi-layer board, and placing decoupling capacitors close to the device.
  • The choice of external components depends on the specific application and design requirements. For the voltage reference, TI recommends using a high-precision, low-drift reference such as the TLV431 or TLVH431. For the current sense resistors, choose a low-value, high-precision resistor with a low temperature coefficient, such as a metal film or thick-film resistor. Consult the datasheet and application notes for specific recommendations and calculations.
  • The UCC3802N can dissipate significant power, especially in high-current applications. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. TI recommends using a heat sink with a thermal resistance of less than 10°C/W, and ensuring good thermal contact between the device and heat sink. Additionally, consider using thermal interface materials and following good thermal design practices.
  • When troubleshooting issues with the UCC3802N, start by verifying the power supply and input voltage, and checking for proper decoupling and bypassing. Use an oscilloscope to monitor the output voltage and current, and look for signs of oscillation or instability. Consult the datasheet and application notes for specific troubleshooting guides and techniques, and consider using TI's online resources and support forums for additional assistance.
  • The UCC3802N is a specific variant of the UCC380x family, with unique features and characteristics. Compared to the UCC3801, the UCC3802N has a higher switching frequency and improved noise immunity. Compared to the UCC3803, the UCC3802N has a different pinout and package type. Consult the datasheet and product page for a detailed comparison of the different devices and their features.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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