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UCC3809D-2 - Texas Instruments

Description: Texas Instruments UCC3809D-2, PWM Secondary Side Controller, 8-Pin SOIC

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UCC3809D-2 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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UCC3809D-2 Details

  • Manufacturer Part Number:

    UCC3809D-2

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    19 V

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    0.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    19 V

  • Supply Voltage-Min (Vsup):

    15 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BCDMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

UCC3809D-2 Frequently Asked Questions (FAQs)

  • The UCC3809D-2 is a high-frequency device, and proper layout and placement are crucial for its operation. TI recommends placing the device close to the power stage, using short and wide traces for the high-current paths, and separating the analog and power grounds. A good layout practice is to use a star-ground configuration and to minimize the loop area of the high-frequency currents.
  • The choice of external components, such as the input filter capacitors, output filter inductors, and feedback resistors, depends on the specific application and design requirements. TI provides a detailed component selection guide in the datasheet and application notes. Engineers should consider factors such as component tolerance, temperature rating, and parasitic effects when selecting external components.
  • The UCC3809D-2 has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may be affected at extreme temperatures. Engineers should ensure that the device is operated within the recommended temperature range and that proper thermal management is implemented to prevent overheating.
  • Troubleshooting issues with the UCC3809D-2 requires a systematic approach. Engineers should first verify that the device is properly powered and configured, and then check for common issues such as incorrect component values, poor layout, or inadequate decoupling. TI provides a troubleshooting guide in the datasheet and application notes, and engineers can also use simulation tools and oscilloscope measurements to identify and fix issues.
  • Yes, the UCC3809D-2 can be used in a synchronous rectification topology. In fact, the device is optimized for synchronous rectification applications. Engineers should ensure that the device is properly configured and that the synchronous rectifier MOSFETs are selected and driven correctly to achieve optimal performance and efficiency.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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