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UCC38500DW - Texas Instruments

Description: BiCMOS PFC/PWM Combination Controller

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UCC38500DW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G20)
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3D Models
UCC38500DW - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G20)
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UCC38500DW Details

  • Manufacturer Part Number:

    UCC38500DW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    CAN ALSO BE PROGRAMMED FOR CURRENT MODE AND VOLTAGE MODE

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER WITH POST REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    10.3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max (Isup):

    4 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    200 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

UCC38500DW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the UCC38500DW evaluation module (EVM) user's guide, which includes guidelines for component placement, trace routing, and thermal management. Following this layout can help minimize noise, reduce electromagnetic interference (EMI), and ensure reliable operation.
  • The UCC38500DW datasheet provides guidelines for selecting external components, including the transformer and output filter. Additionally, Texas Instruments offers online tools, such as the Power Stage Designer (PSD) and the Transformer Design Tool, which can help engineers select and design optimal external components for their specific application.
  • The UCC38500DW has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, engineers should follow proper thermal management practices, such as using a heat sink, thermal interface material, and ensuring good airflow. The UCC38500DW datasheet provides thermal resistance values and guidelines for thermal management.
  • The UCC38500DW has built-in OVP and UVP features, which can be enabled using external resistors and capacitors. The datasheet provides a detailed description of how to implement OVP and UVP, including the required component values and connections.
  • The UCC38500DW is designed to meet EMC standards, such as CISPR 22 and EN 55022. To ensure compliance, engineers should follow proper PCB layout and design practices, use shielding and filtering components, and perform EMC testing and certification. Texas Instruments provides EMC guidelines and resources on their website.

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UCC38500DW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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