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UCC5320SCDR - Texas Instruments

Description: 2A/2A, 3-kVRMS Single-Channel Isolated Gate Driver for Bipolar Supply (E) or With Split Output (S)

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UCC5320SCDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A  SOIC
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UCC5320SCDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A  SOIC
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UCC5320SCDR Details

  • Manufacturer Part Number:

    UCC5320SCDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-07-02

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    TRANSIENT; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    4.4 A

  • Output Peak Current Limit-Nom:

    4.4 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.072 µs

  • Width:

    5.85 mm

UCC5320SCDR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC5320SCDR involves keeping the input and output stages separate, using a star-ground configuration, and placing the device close to the power source. Additionally, using a 4-layer PCB with a solid ground plane and a separate power plane can help reduce EMI.
  • To ensure the UCC5320SCDR operates within its SOA, monitor the device's junction temperature, output current, and input voltage. Use thermal management techniques such as heat sinks or thermal interfaces to keep the junction temperature below 150°C. Also, ensure the output current does not exceed 2A and the input voltage is within the recommended range of 4.5V to 18V.
  • When selecting an output capacitor for the UCC5320SCDR, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. A low-ESR capacitor with a capacitance value between 10uF to 22uF and a voltage rating of at least 20V is recommended. The capacitor should also be able to handle the ripple current and have a low temperature coefficient.
  • To troubleshoot issues with the UCC5320SCDR, start by verifying the input voltage, output voltage, and output current. Check the PCB layout for any signs of noise or oscillations. Use an oscilloscope to measure the output voltage and current waveforms. Ensure the output capacitor is properly selected and the input voltage is within the recommended range. If issues persist, consult the datasheet and application notes for guidance.
  • The UCC5320SCDR has a thermal pad that must be connected to a thermal plane on the PCB to improve heat dissipation. Use a thermal interface material (TIM) to fill any gaps between the device and the heat sink. Ensure good airflow around the device and consider using a heat sink with a thermal conductivity of at least 1W/m-K. Additionally, minimize the thermal resistance of the PCB by using a thick copper layer and thermal vias.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image UCC5320SCD Texas Instruments

Buffer or Inverter Based IGBT/MOSFET Driver, 4.4A, PDSO8