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UCC5350MCQDWVRQ1 - Texas Instruments

Description: Gate Drivers 5-A/5-A, 3-k/5-kVRMS automotive single-channel isolated gate driver with Miller clamp 8-SOIC -40 to 125

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UCC5350MCQDWVRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV Package 8-Pin SOIC
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UCC5350MCQDWVRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DWV Package 8-Pin SOIC
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UCC5350MCQDWVRQ1 Details

  • Manufacturer Part Number:

    UCC5350MCQDWVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-05-31

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Current-Max:

    10 A

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.45

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.1 µs

  • Turn-on Time:

    0.1 µs

  • Width:

    5.85 mm

UCC5350MCQDWVRQ1 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal vias are connected to the ground plane to reduce thermal resistance.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques such as heat sinks or thermal interfaces to maintain a stable temperature.
  • Critical timing parameters for the UCC5350MCQDWVRQ1 include the switching frequency, rise and fall times, and dead time. To ensure these parameters are met, carefully follow the recommended design guidelines, and consider using simulation tools to verify the design before prototyping.
  • To minimize EMI in your design, follow best practices for PCB layout, such as keeping sensitive traces away from noisy components, using shielding, and implementing filtering and shielding techniques. Additionally, consider using EMI-compliant components and following the recommended layout guidelines for the UCC5350MCQDWVRQ1.
  • When selecting input and output capacitors, consider factors such as capacitance value, voltage rating, and equivalent series resistance (ESR). Choose capacitors with low ESR and high reliability to ensure stable operation and minimize losses.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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