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UCC5350SBDR - Texas Instruments

Description: 5A/5A, 3-kVRMS Single-Channel Isolated Gate Driver With Miller Clamp (M) or With Split Output (S)

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UCC5350SBDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-11
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UCC5350SBDR Details

  • Manufacturer Part Number:

    UCC5350SBDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-09-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    TRANSIENT; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    10 A

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    9.5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.1 µs

  • Turn-on Time:

    0.1 µs

  • Width:

    5.85 mm

UCC5350SBDR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and coupling.
  • Use a soft-start circuit to limit the inrush current during start-up. For shutdown, ensure a controlled ramp-down of the output voltage to prevent voltage spikes and oscillations.
  • The UCC5350SBDR has a high power density, so it's essential to consider thermal management. Use a heat sink with a thermal resistance of <1°C/W, and ensure good airflow around the device. Monitor the junction temperature (TJ) and adjust the heat sink design accordingly.
  • Use a combination of capacitors and inductors to filter the output. Optimize the filter design using simulation tools like SPICE or LTspice to minimize ripple and noise. Consider using a pi-filter or an LC filter with a damping resistor.
  • Use a shielded enclosure, and ensure good grounding and bonding. Keep the input and output cables short and away from each other. Use EMI filters and common-mode chokes to reduce emissions. Follow the CISPR 22 and EN 55022 standards for EMI and EMC compliance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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