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UCD90120RGCR - Texas Instruments

Description: DIGITAL-TO-ANALOG CONVERTER (DAC)

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UCD90120RGCR - Texas Instruments - PCB symbol
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PCB Footprints
UCD90120RGCR - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
UCD90120RGCR - Texas Instruments - 3D model - Other - QFN50P900X900X100-65N
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UCD90120RGCR Details

  • Manufacturer Part Number:

    UCD90120RGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    13

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

UCD90120RGCR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power and ground planes as close as possible to minimize inductance. Use a decoupling capacitor (e.g., 10uF) between VCC and GND, and place it close to the device.
  • Use a reliable communication protocol (e.g., I2C or SPI) and ensure proper signal termination. Implement error detection and correction mechanisms, such as checksums or CRC, to detect and correct data transmission errors.
  • The maximum allowed voltage on the input pins is 3.6V. Exceeding this voltage may damage the device. Use voltage dividers or level shifters if the input signal exceeds this voltage.
  • Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate in high-temperature environments. Monitor the device's temperature using the internal temperature sensor or an external thermometer.
  • Power up the device in the following sequence: VCC, then VDD, and finally the input signals. This sequence helps prevent latch-up and ensures proper device operation.

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UCD90120RGCR Overview

Use the download button to access the UCD90120RGCR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like UCD90, or try a keyword search, such as Power Management Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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