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UCD90124RGCR - Texas Instruments

Description: 12-Rail Sequencer

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PCB Footprints
UCD90124RGCR - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
UCD90124RGCR - Texas Instruments  - 3D model - Other - QFN50P900X900X100-65N
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UCD90124RGCR Details

  • Manufacturer Part Number:

    UCD90124RGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    13

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

UCD90124RGCR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCD90124RGCR involves keeping the power and ground planes separate, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The recommended power-up sequence for the UCD90124RGCR is to first apply the 3.3V supply (VIN), followed by the 1.8V supply (VDD), and then the 0.9V supply (VDDA). The power-down sequence should be reversed.
  • The maximum allowed capacitance for the output capacitors on the UCD90124RGCR is 100 μF. Exceeding this value may cause instability in the output voltage.
  • The output voltage of the UCD90124RGCR can be adjusted by connecting a resistor divider network between the VOUT pin and the GND pin. The output voltage is determined by the ratio of the resistors in the divider network.
  • The thermal derating curve for the UCD90124RGCR is typically provided in the device's datasheet or application notes. It shows the maximum allowed power dissipation versus ambient temperature. For the UCD90124RGCR, the thermal derating curve indicates that the maximum power dissipation decreases as the ambient temperature increases.

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UCD90124RGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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