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UCD90160RGCT - Texas Instruments

Description: TEXAS INSTRUMENTS - UCD90160RGCT - POWER SEQUENCER/MONITOR, 0.05A, VQFN-64

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Symbol
UCD90160RGCT - Texas Instruments - PCB symbol
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PCB Footprints
UCD90160RGCT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGC (S-PVQFN-N64)
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3D Models
UCD90160RGCT - Texas Instruments - 3D model - Quad Flat No-Lead - RGC (S-PVQFN-N64)
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UCD90160RGCT Details

  • Manufacturer Part Number:

    UCD90160RGCT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

UCD90160RGCT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power and ground planes as close as possible to the device to minimize inductance. Use a via stitching pattern to connect the power and ground planes to the device pins.
  • Use the TI Fusion Digital Power Designer software to configure the device for your specific application. The software provides a graphical user interface to configure the device's registers and generate the necessary code for your design.
  • Use a thermal pad on the bottom of the device to dissipate heat. Ensure good airflow around the device and consider using a heat sink or thermal interface material to further reduce thermal resistance.
  • Use the built-in debug features of the device, such as the Fault Register and the Status Register, to identify the source of the issue. Consult the datasheet and application notes for troubleshooting guidelines and use TI's support resources, such as the E2E forum, for additional assistance.
  • Yes, the UCD90160RGCT is designed for high-reliability and safety-critical applications. It meets the requirements of various industry standards, such as IEC 61508 and ISO 26262, and is suitable for use in applications such as industrial control systems, medical devices, and automotive systems.

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UCD90160RGCT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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