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UCD9090RGZR - Texas Instruments

Description: Supervisory Circuits 10CH SEQUENCER AND SYS HEALTH MONITOR

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PCB Footprints
UCD9090RGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ (S-PVQFN-N48)
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3D Models
UCD9090RGZR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ (S-PVQFN-N48)
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UCD9090RGZR Details

  • Manufacturer Part Number:

    UCD9090RGZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    11

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

UCD9090RGZR Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to minimize thermal impedance. A thermal via array under the device can also improve heat dissipation.
  • Use a reliable communication protocol like I2C or SPI, and ensure proper signal termination, pull-up resistors, and clock synchronization. Also, implement error detection and correction mechanisms to handle data transmission errors.
  • Choose capacitors with low ESR, high ripple current rating, and a voltage rating that exceeds the maximum input voltage. X5R or X7R ceramic capacitors are recommended. Ensure the capacitors are placed close to the device and connected with short, low-inductance traces.
  • Follow a controlled power-up sequence, starting with the input voltage, then the enable signal, and finally the clock signal. During power-down, reverse this sequence. Ensure a soft-start or ramp-up of the input voltage to prevent inrush currents.
  • Keep the UCD9090 and its associated components away from noise-sensitive areas. Use a solid ground plane, and ensure that high-frequency signals are routed away from the device. Implement proper shielding, and use EMI filters or common-mode chokes if necessary.

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UCD9090RGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image UCD9090RGZT Texas Instruments

Adjustable, 11 Channel, PQCC48