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UCD90910RGCT - Texas Instruments

Description: 10-Rail Sequencer and System Health Monitor with Integrated 10-Channel Fan Controller

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Symbol
UCD90910RGCT - Texas Instruments - PCB symbol
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PCB Footprints
UCD90910RGCT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGC (S-PVQFN-N64)
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3D Models
UCD90910RGCT - Texas Instruments - 3D model - Quad Flat No-Lead - RGC (S-PVQFN-N64)
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UCD90910RGCT Details

  • Manufacturer Part Number:

    UCD90910RGCT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

UCD90910RGCT Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to minimize thermal resistance. A thermal via array under the device can also improve heat dissipation.
  • Use a reliable communication protocol like I2C or SPI, and ensure proper signal termination, pull-up resistors, and clock synchronization. Also, implement error detection and correction mechanisms to handle data transmission errors.
  • Ensure that the power supplies are sequenced correctly, with the analog supply (AVDD) ramping up before the digital supply (DVDD). Also, ensure a slow and controlled voltage ramp-up to prevent damage to the device.
  • Use the device's power-saving features like dynamic voltage scaling, clock gating, and shutdown modes. Also, optimize the system's power management strategy to minimize power consumption during idle periods.
  • Use 1-10uF decoupling capacitors with a voltage rating of 10-25V, placed as close as possible to the device's power pins. Ensure that the capacitors are properly sized and placed to minimize parasitic inductance and resistance.

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UCD90910RGCT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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