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ULQ2003AN - Texas Instruments

Description: Darlington Transistor Arrays

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PCB Footprints
ULQ2003AN - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - N (R-PDIP-T)
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3D Models
ULQ2003AN - Texas Instruments  - 3D model - Dual-In-Line Packages - N (R-PDIP-T)
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ULQ2003AN Details

  • Manufacturer Part Number:

    ULQ2003AN

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    1991-01-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    7

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e4

  • Length:

    19.305 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-COLLECTOR

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.5 A

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Seated Height-Max:

    5.08 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    10 µs

  • Width:

    7.62 mm

ULQ2003AN Frequently Asked Questions (FAQs)

  • A good PCB layout for the ULQ2003AN involves keeping the input and output traces separate, using a solid ground plane, and minimizing loop areas to reduce EMI. TI provides a recommended layout in their application notes.
  • Proper thermal management involves providing a heat sink or thermal pad, ensuring good airflow, and keeping the device away from heat sources. TI recommends a maximum junction temperature of 150°C.
  • Exceeding maximum ratings can lead to device failure or reduced lifespan. To prevent this, ensure that the device operates within the recommended voltage, current, and temperature ranges, and provide adequate heat sinking and protection circuits.
  • Troubleshooting involves checking the input voltage, output voltage, and current, as well as verifying the PCB layout and thermal management. TI provides troubleshooting guides and application notes to help identify and resolve common issues.
  • Yes, in high-reliability or safety-critical applications, consider using redundant circuits, implementing fault detection and correction mechanisms, and following relevant industry standards and guidelines, such as IEC 61508 or DO-254.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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