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UMT3906T106 - ROHM Semiconductor

Description: Bipolar (BJT) Transistor PNP 40 V 200 mA 250MHz 200 mW Surface Mount UMT3 , 200 mA , 100 @ 10mA, 1V , SC-70, SOT-323

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UMT3906T106 - ROHM Semiconductor - PCB symbol
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PCB Footprints
UMT3906T106 - ROHM Semiconductor PCB footprint - Other - Other - SOT-323 SC-70 (UMT3)_2025-1.1
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UMT3906T106 - ROHM Semiconductor - 3D model - Other - SOT-323 SC-70 (UMT3)_2025-1.1
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UMT3906T106 Details

  • Manufacturer Part Number:

    UMT3906T106

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Base Capacitance-Max:

    4 pF

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

  • Turn-off Time-Max (toff):

    300 ns

  • Turn-on Time-Max (ton):

    70 ns

  • VCEsat-Max:

    0.3 V

UMT3906T106 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta = -40°C to 125°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature (Tj) to prevent overheating.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a TVS (transient voltage suppressor) diode or a zener diode to clamp voltage transients. Ensure that the device is operated within the recommended voltage range (Vin = 2.5V to 5.5V). Use a fuse or a PTC (positive temperature coefficient) thermistor to protect against overcurrent.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.

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UMT3906T106 Overview

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