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US6J12TCR - ROHM Semiconductor

Description: Mosfet Array 2 P-Channel (Dual) 12V 2A (Ta) 910mW (Ta) Surface Mount TUMT6

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PCB Footprints
US6J12TCR - ROHM Semiconductor PCB footprint - Other - Other - TUMT6-22
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3D Models
US6J12TCR - ROHM Semiconductor  - 3D model - Other - TUMT6-22
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US6J12TCR Details

  • Manufacturer Part Number:

    US6J12TCR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    30

US6J12TCR Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the US6J12TCR is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet. Typically, this involves applying a voltage between 2.7V and 5.5V to the VCC pin, and ensuring the input voltage (VIN) is within the recommended range. Additionally, consider the device's power dissipation and thermal management to prevent overheating.
  • The maximum allowable power dissipation for the US6J12TCR is dependent on the operating temperature and package type. According to the datasheet, the maximum power dissipation is 250mW for the SOT-23 package. However, it's crucial to calculate the actual power dissipation based on the device's operating conditions and ensure it remains within the recommended limits to prevent overheating and damage.
  • To prevent electrostatic discharge (ESD) damage, follow proper handling and storage procedures. Use an anti-static wrist strap or mat, and ensure the device is stored in an anti-static bag or container. When handling the device, avoid touching the pins or exposed metal surfaces, and use a grounded tip for soldering or probing.
  • For optimal performance and reliability, follow good PCB design practices. Ensure the device is placed on a solid ground plane, and use short, direct traces for power and signal connections. Avoid routing high-frequency signals near the device, and use decoupling capacitors to minimize noise and voltage fluctuations.

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US6J12TCR Overview

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