Littelfuse recommends a thermal pad with a minimum size of 100mm² and a thickness of 1.5mm to ensure optimal heat dissipation. Additionally, a thermal via array with a minimum of 10 vias is recommended to improve thermal conductivity.
While the V14E625P is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB design and layout considerations. However, it's essential to consult with Littelfuse's application engineers to ensure the device meets the specific requirements of your high-frequency application.
The V14E625P is designed to withstand overvoltage conditions up to 1.5 times the rated voltage for a short duration (typically 100ms). In undervoltage conditions, the device will not conduct until the voltage reaches the minimum guaranteed turn-on voltage. It's essential to consult the datasheet and application notes for specific details on voltage tolerance and protection.
Littelfuse recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to ensure the device's reliability and performance.
Yes, the V14E625P can be used in parallel or series configurations to achieve higher current ratings or voltage blocking capabilities. However, it's crucial to consult with Littelfuse's application engineers to ensure proper device selection, PCB design, and thermal management to avoid any potential issues.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
V14E625P Overview
Use the download button to access the V14E625P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like V14E6,
or try a keyword search, such as Non-linear Resistors