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VCA8500IRGCT - Texas Instruments

Description: 8-Channel, Ultra-Low Power Variable Gain Amplifier With Low-Noise Pre-Amp

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Symbol
VCA8500IRGCT - Texas Instruments - PCB symbol
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PCB Footprints
VCA8500IRGCT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGC0064H
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3D Models
VCA8500IRGCT - Texas Instruments - 3D model - Quad Flat No-Lead - RGC0064H
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VCA8500IRGCT Details

  • Manufacturer Part Number:

    VCA8500IRGCT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATES WITH 5 VOLT SUPPLY

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.47 V

  • Supply Voltage-Min (Vsup):

    3.14 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

VCA8500IRGCT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal simulation tools to optimize the design.
  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from sensitive analog circuits. Also, consider using EMI filters and shielding to minimize radiation.
  • Use the device's power-down modes, and optimize the clock frequency and voltage settings for the specific application. Also, consider using power-gating techniques and low-power modes to minimize power consumption.
  • Perform thorough testing of the device's functionality, including voltage and current stress testing, temperature cycling, and vibration testing. Also, consider using accelerated life testing and failure analysis to ensure reliability.

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VCA8500IRGCT Overview

Use the download button to access the VCA8500IRGCT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VCA85, or try a keyword search, such as Other Signal Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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