3D Models
Note! To download footprints and symbols, use the build and request forms below
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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for VLP270F
- Part Number VLP270F
- Manufacturer LITTELFUSE
- Pin Count 999
- Last Modified Date Jul 15, 2026 11:43 AM UTC
- Pinout / Pin List Click Here (Member Only)
VLP270F Details
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Manufacturer Part Number:
VLP270F
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.40.80.70
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Manufacturer:
Littelfuse Inc
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YTEOL:
8.25
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Additional Feature:
Rmin@25 Deg Cel
VLP270F Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the VLP270F is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a minimum clearance of 0.5mm from the edge of the PCB.
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To ensure reliable soldering of the VLP270F, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component, and avoid applying excessive force or pressure during soldering.
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The maximum operating temperature range for the VLP270F is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
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Yes, the VLP270F is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB and can withstand the vibration.
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To handle ESD protection when working with the VLP270F, use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the component pins or handling the device in a way that could generate static electricity.
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VLP270F Overview
Use the download button to access the VLP270F 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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