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VN0104N3-G-P013 - Microchip

Description: MOSFET N-CH Enhancmnt Mode MOSFET

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VN0104N3-G-P013 - Microchip PCB footprint - Other - Other - 3-Lead TO-92 Package Outline (N3)_2021
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VN0104N3-G-P013 - Microchip  - 3D model - Other - 3-Lead TO-92 Package Outline (N3)_2021
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VN0104N3-G-P013 Details

  • Manufacturer Part Number:

    VN0104N3-G-P013

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    0.35 A

  • Drain-source On Resistance-Max:

    3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

VN0104N3-G-P013 Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. The device is rated for operation up to 150°C, but derating may be necessary for extended lifetimes.
  • Microchip recommends following standard ESD protection guidelines, including using ESD-sensitive handling and storage procedures. The device has built-in ESD protection, but additional external protection may be necessary depending on the application and environment.
  • The VN0104N3-G-P013 is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to follow proper PCB design and assembly guidelines, including using a robust PCB material and secure component mounting. Additional mechanical support or potting may be necessary in extreme vibration environments.
  • Microchip recommends following the standard soldering conditions for lead-free soldering, with a peak temperature of 260°C and a dwell time of 10-30 seconds. It's essential to follow proper soldering techniques and guidelines to prevent damage to the device.

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VN0104N3-G-P013 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image VN0104N3 Supertex Inc

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For a full list of alternate parts for VN0104N3-G-P013, check out Findchips.com