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VND5E008AY-E - STMicroelectronics

Description: Double channel high-side driver with analog current sense for automotive applications PowerSSO-36

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VND5E008AY-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO 36(H=2.47mm)
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VND5E008AY-E Details

  • Manufacturer Part Number:

    VND5E008AY-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-36

  • Pin Count:

    36

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    76 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.47 mm

  • Supply Voltage-Max:

    28 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

VND5E008AY-E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the VND5E008AY-E is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing power dissipation. Additionally, consider using a thermally enhanced package or a heat sink to reduce the junction temperature.
  • For optimal performance and reliability, it's recommended to follow a 4-layer PCB design with a solid ground plane, use a minimum of 1 oz copper thickness, and ensure a low-impedance path for the power supply and ground connections. Additionally, keep the PCB layout symmetrical and balanced to minimize electromagnetic interference (EMI).
  • To troubleshoot issues with the VND5E008AY-E, start by verifying the power supply voltage and current, checking for any signs of overheating, and ensuring that the device is properly soldered and connected. Use oscilloscopes or logic analyzers to monitor the device's behavior and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the VND5E008AY-E is sensitive to electrostatic discharge (ESD). To prevent ESD damage, handle the device with anti-static wrist straps, mats, or bags, and ensure that the PCB design includes ESD protection diodes or resistors. Follow proper ESD handling and storage procedures to prevent damage during manufacturing, testing, and shipping.

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VND5E008AY-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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