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VND830LSP - STMicroelectronics

Description: Power Switch/Driver 1:1 N-Channel 18A 10-PowerSO , Surface Mount , 18 A , 60mOhm (Max) , 5.5V ~ 36V , -40°C ~ 150°C (TJ)

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VND830LSP - STMicroelectronics PCB footprint - Other - Other - PowerSO-10_2026-6.1
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VND830LSP Details

  • Manufacturer Part Number:

    VND830LSP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, POWER, SO-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    9.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    23 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP10,.55FL

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.75 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

VND830LSP Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4979, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The VND830LSP has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
  • The VND830LSP is rated for operation from -40°C to 150°C, but the maximum junction temperature (Tj) should not exceed 150°C. The device should be derated for temperatures above 125°C to ensure reliability.
  • The VND830LSP can be programmed using the SPI interface. STMicroelectronics provides a programming guide and software tools, such as the STSW-VND830LSP, to help developers configure and program the device.
  • The typical current consumption of the VND830LSP depends on the operating mode and frequency. According to the datasheet, the typical current consumption is around 10mA at 100kHz, but this can vary depending on the specific application and usage.

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VND830LSP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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