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VO2611-X007T - Vishay

Description: Vishay VO2611-X007T DC Input, Optocoupler, SMT PDIP 8

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PCB Footprints
VO2611-X007T - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SMD-8 (Option 7)-ren1
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3D Models
VO2611-X007T - Vishay  - 3D model - Small Outline Packages - SMD-8 (Option 7)-ren1
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VO2611-X007T Details

  • Manufacturer Part Number:

    VO2611-X007T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.5

  • Additional Feature:

    CMOS COMPATIBLE, UL RECOGNIZED

  • Configuration:

    SINGLE

  • Data Rate-Nom:

    10 MBps

  • Forward Current-Max:

    0.02 A

  • Forward Voltage-Max:

    1.7 V

  • Isolation Voltage-Max:

    5300 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.085 W

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

VO2611-X007T Frequently Asked Questions (FAQs)

  • The recommended storage condition for VO2611-X007T is in a dry, cool place, away from direct sunlight, and in its original packaging or anti-static bag to prevent electrostatic discharge (ESD) damage.
  • While VO2611-X007T has a high operating temperature range, it's essential to consider the derating curves and thermal management to ensure reliable operation. Consult with a thermal expert or Vishay's application engineers for specific guidance.
  • Handle VO2611-X007T by the body, avoiding touching the leads or electrical contacts. Use a soldering iron with a temperature below 260°C (500°F) and a solder with a melting point above 217°C (423°F) to prevent thermal shock.
  • Refer to Vishay's application note or consult with a PCB design expert to ensure optimal land pattern and layout for VO2611-X007T, considering thermal management, signal integrity, and EMI reduction.
  • While VO2611-X007T is designed to be robust, it's crucial to consider the specific vibration and shock requirements of your application. Consult with a mechanical engineer or Vishay's application engineers to ensure the device can withstand the environmental stresses.

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VO2611-X007T Overview

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