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VO3063-X007T - Vishay

Description: Triac & SCR Output Optocouplers Zero Crossing Photo Triac 600V 5mA

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VO3063-X007T - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - VO3063-X007T
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VO3063-X007T Details

  • Manufacturer Part Number:

    VO3063-X007T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.5

  • Additional Feature:

    UL RECOGNIZED

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.06 A

  • Input Trigger Current-Max:

    0.005 A

  • Isolation Voltage-Max:

    4420 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.1 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Peak Off-state Voltage-Min:

    600 V

  • Peak Surge Current:

    1 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Reverse Leakage Current-Max:

    0.00001 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

VO3063-X007T Frequently Asked Questions (FAQs)

  • The recommended storage condition for VO3063-X007T is in a dry, cool place, away from direct sunlight, and in its original packaging or anti-static bag to prevent electrostatic discharge damage.
  • While VO3063-X007T has a high operating temperature range, it's essential to consider the derating curves and thermal management to ensure reliable operation. Consult the datasheet and application notes for guidance.
  • Follow standard handling and soldering procedures for sensitive electronic components. Use a soldering iron with a temperature below 260°C, and avoid applying excessive force or bending the component during assembly.
  • Refer to the datasheet and application notes for recommended PCB layout and land pattern guidelines. Ensure proper thermal management and signal integrity by following the suggested design practices.
  • While VO3063-X007T is designed to be robust, it's essential to consider the specific vibration and shock requirements of your application. Consult the datasheet and application notes for guidance on mechanical stress and reliability.

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VO3063-X007T Overview

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