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VP2206N2 - Microchip

Description: P-Channel Enhancement-Mode Vertical DMOS FET

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VP2206N2 - Microchip PCB footprint - Other - Other - TO-39 **
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VP2206N2 Details

  • Manufacturer Part Number:

    VP2206N2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN TO-39, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-39-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    HIGH INPUT IMPEDANCE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.75 A

  • Drain-source On Resistance-Max:

    0.9 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JEDEC-95 Code:

    TO-39

  • JESD-30 Code:

    O-MBCY-W3

  • JESD-609 Code:

    e4

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    METAL

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    6 W

  • Pulsed Drain Current-Max (IDM):

    8 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    WIRE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    100 ns

  • Turn-on Time-Max (ton):

    40 ns

VP2206N2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and use a thermal pad on the PCB.
  • Ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7 μF to 10 μF is recommended for input decoupling. The capacitor should be placed close to the device's input pins.
  • Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke or ferrite bead to filter the output. Also, ensure good PCB layout practices, such as separating analog and digital grounds.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10 μF to 22 μF is recommended for output filtering. The capacitor should be placed close to the device's output pins.

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VP2206N2 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image VP2206N2-G Microchip Technology Inc

Small Signal Field-Effect Transistor, 0.75A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-39