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VS-150MT060WDF - Vishay

Description: MTP IGBT Power Module Primary Dual Forward Schottky Diodes & Rectifiers Output & SW Modules - MTP SWITCH-e3,600V,11~96A

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VS-150MT060WDF - Vishay PCB footprint - Other - Other - MTP
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VS-150MT060WDF Details

  • Manufacturer Part Number:

    VS-150MT060WDF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    138 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

  • Gate-Emitter Thr Voltage-Max:

    6.2 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-PUFM-P14

  • Number of Elements:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    57 W

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    NO

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    458 ns

  • Turn-on Time-Nom (ton):

    247 ns

VS-150MT060WDF Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-150MT060WDF is a rectangular pad with dimensions of 6.5mm x 3.5mm, with a 1.5mm x 1.5mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the component. Avoid using excessive solder or flux, as it can cause bridging or shorts.
  • The maximum operating temperature range for the VS-150MT060WDF is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
  • The VS-150MT060WDF is not designed for use in high-humidity environments. It is recommended to use a conformal coating or potting compound to protect the device from moisture and humidity. Additionally, ensure that the PCB is designed with moisture-resistant materials and has adequate drainage to prevent water accumulation.
  • The VS-150MT060WDF is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process also follow ESD protection guidelines to prevent damage during manufacturing and handling.

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VS-150MT060WDF Overview

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