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VS-60CPU06-F - Vishay

Description: Ultrafast Rectifier

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PCB Footprints
VS-60CPU06-F - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO 247 AC_1
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3D Models
VS-60CPU06-F - Vishay  - 3D model - Transistor Outline, Vertical - TO 247 AC_1
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VS-60CPU06-F Details

  • Manufacturer Part Number:

    VS-60CPU06-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE

  • Application:

    ULTRA FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.65 V

  • JEDEC-95 Code:

    TO-247AC

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

VS-60CPU06-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-60CPU06-F is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • Yes, the VS-60CPU06-F is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated and that the application meets the recommended operating conditions.
  • To ensure the reliability of the VS-60CPU06-F in high-reliability applications, follow proper handling and storage procedures, use a clean and dry environment, and avoid exposing the device to mechanical stress or electrical overstress. Additionally, perform thorough testing and inspection during the manufacturing process.
  • The VS-60CPU06-F is designed for low-frequency applications up to 100 kHz. While it may be possible to use it in high-frequency applications, the device's performance and reliability may be compromised. It's recommended to consult with Vishay Intertechnologies or a qualified engineer for specific guidance.
  • The recommended soldering profile for the VS-60CPU06-F is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.

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VS-60CPU06-F Overview

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