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W29N04GVSIAF - Winbond

Description: • Basic Features – Density: 4Gbit (Single chip solution) – Vcc: 2.7V to 3.6V – Bus width: x8 – Operating temperature ▪ Industrial: -40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 4G-bit/512M-byte – Page size ▪ 2,112 bytes (2048 + 64 bytes) – Block size ▪ 64 pages (128K + 4K bytes) • Highest Performance – Read performance (Max.) ▪ Random read: 25us ▪ Sequential read cycle: 25ns – Write Erase performance ▪ Page program time: 250us(typ.) ▪ Block erase time: 2ms(

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W29N04GVSIAF - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - TSOP 48-pin 12x20
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W29N04GVSIAF - Winbond  - 3D model - Small Outline Packages - TSOP 48-pin 12x20
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W29N04GVSIAF Details

  • Manufacturer Part Number:

    W29N04GVSIAF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP1-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    5.5

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    18.4 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    ONFI 1.0

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

  • Write Cycle Time-Max (tWC):

    0.025 ms

  • Write Protection:

    HARDWARE

W29N04GVSIAF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the W29N04GVSIAF is -40°C to 85°C.
  • The hold signal (HOLD#) should be asserted low during a write operation to prevent any other access to the device.
  • The WP# (Write Protect) pin is used to prevent write operations to the device. When WP# is low, the device is write-protected.
  • The device density can be determined by reading the device ID, which is 0xEF 0x40 0x15 for the W29N04GVSIAF.
  • The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal.

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