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W631GU6MB11S - Winbond

Description:  Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V  Backward compatible to VDD, VDDQ = 1.5V ± 0.075V  Double Data Rate architecture: two data transfers per clock cycle  Eight internal banks for concurrent operation  8 bit prefetch architecture  CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14  Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)  Programmable read burst ordering: interleaved or nibble sequential  Bi-directional, d

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W631GU6MB11S - Winbond PCB footprint - BGA - BGA - VFBGA96
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W631GU6MB11S - Winbond  - 3D model - BGA - VFBGA96
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W631GU6MB11S Details

  • Manufacturer Part Number:

    W631GU6MB11S

  • Manufacturer:

    Winbond Electronics Corp

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