W631G Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GU6NB11I Winbond	1	The W631GU6NB is a 1G bits DDR3L SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GU6NB11I	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB15I Winbond	1	The W631GU6NB is a 1G bits DDR3L SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GU6NB15I	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB11J Winbond	1	The W631GG6NB is a 1G bits DDR3 SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GG6NB11J	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB-11 Winbond	1	The W631GG6NB is a 1G bits DDR3 SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GG6NB-11	3D model available Symbol and footprint available 3	1 Download Model

	W631GU6NB12I Winbond	1	The W631GU6NB is a 1G bits DDR3L SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GU6NB12I	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB11I Winbond	1	The W631GG6NB is a 1G bits DDR3 SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GG6NB11I	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8NB-15 Winbond	1	The W631GU8NB is a 1G bits DDR3L SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GU8NB-15	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB12S Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU6MB12S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB15W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB15W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB-09 Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (8x10.5)	BGA	W631GU8RB-09	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB12S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB12S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB11S Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB11S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11S Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB-11 Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W631GU8RB-11	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB15S Winbond	1	1Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W631GU6NB15S	3D model available Symbol and footprint available 3	1 Download Model

	W631GG6NB11S Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB11S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB09A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6NB09A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB12I Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU6RB12I	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB11S Winbond	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, d	BGA	W631GU6MB11S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB11A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB09K Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB11W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB11W Winbond	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, d	BGA	W631GU6MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB09S Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6NB09S	3D model available Symbol and footprint available 3	1 Download Model
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