W632GG8NB15I - Winbond

W632GG8NB15I Details

• Manufacturer Part Number:

  W632GG8NB15I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  VFBGA-78

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  0

• Access Mode:

  MULTI BANK PAGE BURST

• Additional Feature:

  AUTO/SELF REFRESH

• JESD-30 Code:

  R-PBGA-B78

• Length:

  10.5 mm

• Memory Density:

  2147483648 bit

• Memory IC Type:

  DDR3 DRAM

• Memory Width:

  8

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  78

• Number of Words:

  268435456 words

• Number of Words Code:

  256000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  95 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  256MX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Seated Height-Max:

  1 mm

• Supply Voltage-Max (Vsup):

  1.575 V

• Supply Voltage-Min (Vsup):

  1.425 V

• Supply Voltage-Nom (Vsup):

  1.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  8 mm