W632G Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W632GU6NB-12 Winbond	1	The W632GU6NB is a 2G bits DDR3L SDRAM and speed involving -09, -11, -12, -15, 09I, 11I, 12I, 15I, 09J, 11J, 12J and 15J.	BGA	W632GU6NB-12	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB12I Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GG8NB12I	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB12J Winbond	1	DDR3 SDRAM 1600MHz	BGA	W632GG8NB12J	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB15J Winbond	1	DDR3 SDRAM 1333MHz	BGA	W632GG8NB15J	3D model available Symbol and footprint available 3	1 Download Model

	W632GG8NB-15 Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GG8NB-15	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB-11 Winbond	1	The W632GG6NB is a 2G bits DDR3 SDRAM and speed involving -09, -11, -12, -15, 09I, 11I, 12I, 15I, 09J, 11J, 12J and 15J.	BGA	W632GG6NB-11	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB15I Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GG8NB15I	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB12A Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GG8NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB09S Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GG6MB09S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB15K Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GG8NB15K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB09A Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6MB09A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8QB-09 Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, dif	BGA	W632GU8QB-09	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB12J Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6RB12J	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB11A Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GG6MB11A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB12S Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 667 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB12S	3D model available Symbol and footprint available 3	1 Download Model

	W632GU8RB12J Winbond	1	⚫ Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, d	BGA	W632GU8RB12J	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB11A Winbond	1	VFBGA96	BGA	W632GU6NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB15S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB15S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB12S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB12S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB12K Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GU8NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB11K Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB12W Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB12W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB11J Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GU8RB11J	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB15S Winbond	1	DDR3 SDRAM 1333MHz	BGA	W632GU8MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB09S Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W632GU8NB09S	3D model available Symbol and footprint available 3	1 Download Model
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