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W632GU6NB-12 - Winbond

Description: The W632GU6NB is a 2G bits DDR3L SDRAM and speed involving -09, -11, -12, -15, 09I, 11I, 12I, 15I, 09J, 11J, 12J and 15J.

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PCB Footprints
W632GU6NB-12 - Winbond PCB footprint - BGA - BGA - W631GG6MB-11
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3D Models
W632GU6NB-12 - Winbond  - 3D model - BGA - W631GG6MB-11
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W632GU6NB-12 Details

  • Manufacturer Part Number:

    W632GU6NB-12

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VFBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    DDR3L DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    128MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.45 V

  • Supply Voltage-Min (Vsup):

    1.283 V

  • Supply Voltage-Nom (Vsup):

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.5 mm

W632GU6NB-12 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the W632GU6NB-12 is -40°C to 85°C.
  • The power-up and power-down sequences for the W632GU6NB-12 should be handled according to the recommended power-up and power-down sequences outlined in the datasheet, which involves ramping up the VCC and VPP voltages in a specific order.
  • The recommended PCB layout and design considerations for the W632GU6NB-12 include using a 4-layer PCB, placing decoupling capacitors near the power pins, and using a solid ground plane to reduce noise and improve signal integrity.
  • The write protection mechanism for the W632GU6NB-12 can be implemented by using the WP pin to enable or disable write operations, and by using the block protection bits to protect specific blocks of memory from write operations.
  • The timing requirements for the W632GU6NB-12 include the clock frequency, clock rise and fall times, and data setup and hold times. To ensure that your design meets these requirements, you should carefully review the datasheet and use a timing analyzer tool to verify that your design meets the specified timing requirements.

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W632GU6NB-12 Overview

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