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W634GG6NB15J - Winbond

Description:  Power Supply: VDD, VDDQ = 1.5V ± 0.075V  Double Data Rate architecture: two data transfers per clock cycle  Eight internal banks for concurrent operation  8 bit prefetch architecture  CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14  Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)  Programmable read burst ordering: interleaved or nibble sequential  Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w

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PCB Footprints
W634GG6NB15J - Winbond PCB footprint - BGA - BGA - VFBGA96 *
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3D Models
W634GG6NB15J - Winbond  - 3D model - BGA - VFBGA96 *
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W634GG6NB15J Details

  • Manufacturer Part Number:

    W634GG6NB15J

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Date Of Intro:

    2019-07-29

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR3 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.575 V

  • Supply Voltage-Min (Vsup):

    1.425 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

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This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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