W634GU8NB11J - Winbond

W634GU8NB11J Details

• Manufacturer Part Number:

  W634GU8NB11J

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  VFBGA-78

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  4

• Access Mode:

  MULTI BANK PAGE BURST

• Access Time-Max:

  20 ns

• Clock Frequency-Max (fCLK):

  933 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  4,8

• JESD-30 Code:

  R-PBGA-B78

• Length:

  10.5 mm

• Memory Density:

  4294967296 bit

• Memory IC Type:

  DDR3L DRAM

• Memory Width:

  8

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  78

• Number of Words:

  536870912 words

• Number of Words Code:

  512000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  512MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA78,9X13,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Refresh Cycles:

  8192

• Seated Height-Max:

  1 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  4,8

• Standby Current-Max:

  0.029 A

• Supply Current-Max:

  0.375 mA

• Supply Voltage-Max (Vsup):

  1.45 V

• Supply Voltage-Min (Vsup):

  1.283 V

• Supply Voltage-Nom (Vsup):

  1.35 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  9 mm