W63AH2NBVABE - Winbond

W63AH2NBVABE Details

• Manufacturer Part Number:

  W63AH2NBVABE

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  VFBGA-178

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.32

• Date Of Intro:

  2019-05-30

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  4

• Access Mode:

  MULTI BANK PAGE BURST

• Additional Feature:

  SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX

• Clock Frequency-Max (fCLK):

  800 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  8

• JESD-30 Code:

  R-PBGA-B178

• Length:

  11.5 mm

• Memory Density:

  1073741824 bit

• Memory IC Type:

  LPDDR3 DRAM

• Memory Width:

  32

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  178

• Number of Words:

  33554432 words

• Number of Words Code:

  32000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -25 °C

• Organization:

  32MX32

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA178,13X17,32/25

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Seated Height-Max:

  1 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  8

• Standby Current-Max:

  0.005 A

• Supply Current-Max:

  0.036 mA

• Supply Voltage-Max (Vsup):

  1.3 V

• Supply Voltage-Min (Vsup):

  1.14 V

• Supply Voltage-Nom (Vsup):

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  11 mm