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W66BQ6NBUAFJ - Winbond

Description: This is a 2Gb Low Power DDR4X SDRAM organized as 16M words x 8 banks x 16bits with single channel

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Symbol
W66BQ6NBUAFJ - Winbond - PCB symbol
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PCB Footprints
W66BQ6NBUAFJ - Winbond PCB footprint - BGA - BGA - TFBGA 200 Ball (10x14.5 mm2 , Ball pitch: 0.8 x 0.65mm)
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3D Models
W66BQ6NBUAFJ - Winbond - 3D model - BGA - TFBGA 200 Ball (10x14.5 mm2 , Ball pitch: 0.8 x 0.65mm)
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W66BQ6NBUAFJ Details

  • Manufacturer Part Number:

    W66BQ6NBUAFJ

  • Manufacturer:

    Winbond Electronics Corp

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W66BQ6NBUAFJ Overview

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