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W66CM2NQUAHI - Winbond

Description: LPDDR4 DRAM Chip

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PCB Footprints
W66CM2NQUAHI - Winbond PCB footprint - Other - Other - WFBGA-200 Ball (10x14.5 mm2, Ball pitch: 0.8 x 0.65mm)
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3D Models
W66CM2NQUAHI - Winbond  - 3D model - Other - WFBGA-200 Ball (10x14.5 mm2, Ball pitch: 0.8 x 0.65mm)
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W66CM2NQUAHI Details

  • Manufacturer Part Number:

    W66CM2NQUAHI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WFBGA-200

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Date Of Intro:

    2019-06-10

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    5

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMIMAL SUPPLY VOLTAGE; TERM PITCH-MAX

  • Clock Frequency-Max (fCLK):

    2136.7 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    16,32

  • JESD-30 Code:

    R-PBGA-B200

  • Length:

    14.5 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    LPDDR4X DRAM

  • Memory Width:

    32

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    200

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA200,12X20,32/25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    0.8 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    16,32

  • Supply Voltage-Max (Vsup):

    1.17 V

  • Supply Voltage-Min (Vsup):

    1.06 V

  • Supply Voltage-Nom (Vsup):

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10 mm

W66CM2NQUAHI Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the signal traces short and direct, using a solid ground plane, and placing decoupling capacitors close to the chip. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • The W66CM2NQUAHI requires a specific power-up and power-down sequencing to ensure proper operation. The recommended sequence is to power up the VCCQ and VCCD pins simultaneously, followed by the VREF pin, and then the VPP pin. During power-down, the sequence should be reversed.
  • The W66CM2NQUAHI has an operating temperature range of -40°C to 85°C, but it's recommended to operate within the industrial temperature range of -40°C to 70°C for optimal performance and reliability.
  • To implement clock signal integrity and jitter reduction, use a high-quality clock source, such as a crystal oscillator, and ensure that the clock signal is properly terminated and routed on the PCB. Additionally, consider using a clock buffer or jitter attenuator to further reduce clock jitter.
  • The recommended settings for the device's configuration registers depend on the specific application and use case. However, a general guideline is to follow the default settings recommended in the datasheet and adjust them as needed based on the system's requirements and performance characteristics.

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