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W66CP2NQUAFJ - Winbond

Description: DRAM 4Gb LPDDR4, DDP, x32, 1600MHz, -40C 105C

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Symbol

W66CP2NQUAFJ - Winbond - PCB symbol

PCB Footprints

W66CP2NQUAFJ - Winbond PCB footprint - BGA - BGA - WFBGA 200 Ball (10x14.5 mm2 , Ball pitch: 0.8 x 0.65mm)

3D Models

W66CP2NQUAFJ - Winbond - 3D model - BGA - WFBGA 200 Ball (10x14.5 mm2 , Ball pitch: 0.8 x 0.65mm)

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Stock & Prices Price & Stock for W66CP2NQUAFJ
Part Number W66CP2NQUAFJ
Manufacturer Winbond
Pin Count 200
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - WFBGA 200 Ball (10x14.5 mm2 , Ball pitch: 0.8 x 0.65mm)
Released Date May 2, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

W66CP2NQUAFJ Details

Manufacturer Part Number:
W66CP2NQUAFJ
Manufacturer:
Winbond Electronics Corp

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