AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX
Clock Frequency-Max (fCLK):
2137 MHz
I/O Type:
COMMON
Interleaved Burst Length:
16,32
JESD-30 Code:
R-PBGA-B200
Length:
14.5 mm
Memory Density:
4294967296 bit
Memory IC Type:
LPDDR4 DRAM
Memory Width:
32
Number of Functions:
1
Number of Ports:
1
Number of Terminals:
200
Number of Words:
134217728 words
Number of Words Code:
128000000
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Organization:
128MX32
Package Body Material:
PLASTIC/EPOXY
Package Code:
WFBGA
Package Equivalence Code:
BGA200,12X22,32/25
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, VERY VERY THIN PROFILE, FINE PITCH
Refresh Cycles:
8192
Seated Height-Max:
0.8 mm
Self Refresh:
YES
Sequential Burst Length:
16,32
Standby Current-Max:
0.006 A
Supply Current-Max:
0.39 mA
Supply Voltage-Max (Vsup):
1.17 V
Supply Voltage-Min (Vsup):
1.06 V
Supply Voltage-Nom (Vsup):
1.1 V
Surface Mount:
YES
Technology:
CMOS
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Width:
10 mm
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