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W9412G6KH-5I - Winbond

Description: DRAM 128Mb DDR SDRAM x16 200MHz, Ind. Temp 46nm

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W9412G6KH-5I Details

  • Manufacturer Part Number:

    W9412G6KH-5I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP2-66

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.02

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    0.7 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PDSO-G66

  • Length:

    22.22 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    DDR1 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    66

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    2.7 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10.16 mm

W9412G6KH-5I Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the chip. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • The W9412G6KH-5I requires a specific power-up and power-down sequencing to prevent damage. The recommended sequence is to power up the VCCIO and VCC cores simultaneously, followed by the VREF pin. During power-down, the sequence should be reversed.
  • The W9412G6KH-5I has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat dissipation through a heat sink or thermal pad, especially in high-temperature environments or high-frequency applications.
  • To ensure clock signal integrity and reduce jitter, it's recommended to use a high-quality clock source, such as a crystal oscillator, and to implement a clock tree with minimal skew and jitter. Additionally, using a clock buffer or repeater can help to reduce signal degradation.
  • The W9412G6KH-5I has built-in ESD protection, but it's still essential to handle the device with care to prevent damage. Use an anti-static wrist strap or mat, and avoid touching the pins or exposed die. Store the device in an anti-static bag or container when not in use.

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W9412G6KH-5I Overview

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Part Image W9412G6KH-5 Winbond Electronics Corp

DDR1 DRAM, 8MX16, 0.7ns, CMOS, PDSO66