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W948D6KBHX5E - Winbond

Description: 256Mb Low Power DDR SDRAM 400MHz VFBGA60

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W948D6KBHX5E - Winbond - PCB symbol
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PCB Footprints
W948D6KBHX5E - Winbond PCB footprint - BGA - BGA - VFBGA 60 Balls (8x9 mm2 , Ball pitch: 0.8mm, Ø =0.42mm)
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3D Models
W948D6KBHX5E - Winbond - 3D model - BGA - VFBGA 60 Balls (8x9 mm2 , Ball pitch: 0.8mm, Ø =0.42mm)
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W948D6KBHX5E Details

  • Manufacturer Part Number:

    W948D6KBHX5E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VFBGA-60

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.24

  • Date Of Intro:

    2017-05-25

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B60

  • Length:

    9 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    DDR1 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    60

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Organization:

    16MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1.025 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

W948D6KBHX5E Frequently Asked Questions (FAQs)

  • The W948D6KBHX5E has an operating temperature range of -40°C to 85°C.
  • The POR sequence for the W948D6KBHX5E involves applying power to the device, waiting for the internal voltage regulator to stabilize, and then releasing the reset signal. Refer to the datasheet for specific timing requirements.
  • For optimal performance, it is recommended to use a solid ground plane, decouple the power pins with 0.1uF capacitors, and route the power and ground pins as close together as possible to minimize inductance.
  • A reliable boot process for the W948D6KBHX5E involves configuring the boot mode pins correctly, using a valid boot loader, and ensuring that the boot sequence is properly timed. Refer to the datasheet and application notes for specific guidance.
  • To minimize EMI and ensure EMC, use a shielded enclosure, keep signal lines short and away from noise sources, and use filtering and shielding on I/O lines. Refer to the datasheet and relevant industry standards for specific guidance.

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W948D6KBHX5E Overview

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