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W948D6KBHX6E - Winbond

Description: 256Mb Low Power DDR SDRAM 333MHz VFBGA60

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PCB Footprints
W948D6KBHX6E - Winbond PCB footprint - BGA - BGA - VFBGA 60 Balls (8x9 mm2, Ball pitch: 0.8mm, Ø =0.42mm)
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3D Models
W948D6KBHX6E - Winbond  - 3D model - BGA - VFBGA 60 Balls (8x9 mm2, Ball pitch: 0.8mm, Ø =0.42mm)
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W948D6KBHX6E Details

  • Manufacturer Part Number:

    W948D6KBHX6E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VFBGA-60

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.24

  • Date Of Intro:

    2017-05-25

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B60

  • Length:

    9 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    DDR1 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    60

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Organization:

    16MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1.025 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

W948D6KBHX6E Frequently Asked Questions (FAQs)

  • Winbond provides a recommended PCB layout guide in their application note AN-001, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and reliability.
  • According to Winbond's application note AN-002, it's recommended to power up the VCCQ pin first, followed by the VCC pin, and then the VREF pin. During power-down, the sequence should be reversed. Additionally, ensure that the power supply voltage is stable and within the recommended range before applying clock signals.
  • Although the datasheet specifies an operating temperature range of 0°C to 70°C, Winbond's reliability report indicates that the device can operate reliably up to 85°C with some derating. However, it's essential to consult with Winbond's technical support for specific guidance on operating temperature ranges beyond 70°C.
  • Winbond recommends using ECC (Error-Correcting Code) or CRC (Cyclic Redundancy Check) mechanisms to detect and correct errors. The W948D6KBHX6E has built-in ECC support, and Winbond provides example code and guidelines for implementing ECC and CRC in their application notes and technical documentation.
  • Winbond provides recommended timing parameters in their datasheet and application notes. However, the optimal settings may vary depending on the specific system design and operating conditions. It's recommended to consult with Winbond's technical support or perform thorough characterization and validation to determine the best timing settings for your specific application.

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W948D6KBHX6E Overview

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Part Image W948D6FBHX6I Winbond Electronics Corp

LPDDR1 DRAM, 16MX16, 5ns, CMOS, PBGA60