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W948D6KBHX6I - Winbond

Description: 256Mb Low Power DDR SDRAM 333MHz VFBGA60

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PCB Footprints
W948D6KBHX6I - Winbond PCB footprint - BGA - BGA - VFBGA 60 Balls (8x9 mm2, Ball pitch: 0.8mm, Ø =0.42mm)
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3D Models
W948D6KBHX6I - Winbond  - 3D model - BGA - VFBGA 60 Balls (8x9 mm2, Ball pitch: 0.8mm, Ø =0.42mm)
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W948D6KBHX6I Details

  • Manufacturer Part Number:

    W948D6KBHX6I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VFBGA-60

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.24

  • Date Of Intro:

    2017-05-25

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B60

  • Length:

    9 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    DDR1 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    60

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1.025 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

W948D6KBHX6I Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the signal traces short and direct, using a solid ground plane, and placing decoupling capacitors close to the chip. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • The W948D6KBHX6I requires a specific power-up and power-down sequencing to ensure proper operation. The recommended sequence is to power up VCC first, followed by VCCQ, and then the input signals. During power-down, the input signals should be turned off first, followed by VCCQ, and finally VCC.
  • The W948D6KBHX6I has an operating temperature range of -40°C to 85°C, but it's recommended to operate within the industrial temperature range of -40°C to 70°C for optimal performance and reliability.
  • To implement clock signal integrity and jitter reduction, use a high-quality clock source, such as a crystal oscillator, and ensure that the clock signal is properly terminated and routed. Additionally, use a clock buffer or repeater to reduce jitter and improve signal quality.
  • The recommended settings for the device's configuration registers depend on the specific application and use case. However, a general guideline is to follow the default settings recommended in the datasheet and adjust them as needed based on the system's requirements and performance metrics.

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W948D6KBHX6I Overview

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Part Image W948D6FBHX6I Winbond Electronics Corp

LPDDR1 DRAM, 16MX16, 5ns, CMOS, PBGA60