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W956D8MBYA5I - Winbond

Description: 64Mb HYPERRAM 400MHz TFBGA (5X5)24

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PCB Footprints
W956D8MBYA5I - Winbond PCB footprint - BGA - BGA - Package Outline TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays), Ball pitch: 1.00mm, Ø =0.40mm)*
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3D Models
W956D8MBYA5I - Winbond  - 3D model - BGA - Package Outline TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays), Ball pitch: 1.00mm, Ø =0.40mm)*
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W956D8MBYA5I Details

  • Manufacturer Part Number:

    W956D8MBYA5I

  • Manufacturer:

    Winbond Electronics Corp

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W956D8MBYA5I Overview

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