W957D8MFYA5I - Winbond

W957D8MFYA5I Details

• Manufacturer Part Number:

  W957D8MFYA5I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-24

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.02

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  4

• Access Mode:

  HYPER BUS

• Access Time-Max:

  35 ns

• Clock Frequency-Max (fCLK):

  200 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  16,32,64,128

• JESD-30 Code:

  R-PBGA-B24

• Length:

  8 mm

• Memory Density:

  134217728 bit

• Memory IC Type:

  PSEUDO STATIC RAM

• Memory Width:

  16

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  24

• Number of Words:

  8388608 words

• Number of Words Code:

  8000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  8MX16

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Equivalence Code:

  BGA24,5X5,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Refresh Cycles:

  8192

• Seated Height-Max:

  1.2 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  16,32,64,128

• Standby Current-Max:

  0.00044 A

• Supply Current-Max:

  0.05 mA

• Supply Voltage-Max (Vsup):

  2 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  6 mm