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W971GG6NB-25 - Winbond

Description: 1Gb DDR2 SDRAM 800MHz VFBGA84

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Symbol
W971GG6NB-25 - Winbond - PCB symbol
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PCB Footprints
W971GG6NB-25 - Winbond PCB footprint - BGA - BGA - Package Outline VFBGA84 Ball (8x12.5 mm2 , Ball pitch: 0.8mm)
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3D Models
W971GG6NB-25 - Winbond - 3D model - BGA - Package Outline VFBGA84 Ball (8x12.5 mm2 , Ball pitch: 0.8mm)
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W971GG6NB-25 Details

  • Manufacturer Part Number:

    W971GG6NB-25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-84

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Clock Frequency-Max (fCLK):

    125 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B84

  • Length:

    12.5 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    DDR2 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    84

  • Number of Words:

    67108864 words

  • Number of Words Code:

    64000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Organization:

    64MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA84,9X15,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.008 A

  • Supply Current-Max:

    0.14 mA

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

W971GG6NB-25 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the W971GG6NB-25 is -40°C to 85°C.
  • The power-up and power-down sequences for the W971GG6NB-25 should be handled according to the recommended power-up and power-down sequences outlined in the datasheet, which involves ramping up the voltage supply and clock signals in a specific order to ensure proper device operation.
  • The recommended PCB layout and routing for the W971GG6NB-25 involves following the guidelines outlined in the datasheet, which includes using a 4-layer PCB, placing decoupling capacitors near the power pins, and routing the clock and data signals to minimize noise and crosstalk.
  • Error correction and detection for the W971GG6NB-25 can be implemented using ECC (Error-Correcting Code) or CRC (Cyclic Redundancy Check) techniques, which involve adding redundant data to the memory and checking for errors during data transfer.
  • When using the W971GG6NB-25 in a high-reliability or safety-critical application, considerations include implementing redundant systems, using error correction and detection mechanisms, and following strict testing and validation procedures to ensure the device meets the required reliability and safety standards.

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W971GG6NB-25 Overview

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