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W971GG6SB-25 - Winbond

Description: DRAM 1G, DDR2-800, x16

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PCB Footprints
W971GG6SB-25 - Winbond PCB footprint - BGA - BGA - WBGA-84-
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3D Models
W971GG6SB-25 - Winbond  - 3D model - BGA - WBGA-84-
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W971GG6SB-25 Details

  • Manufacturer Part Number:

    W971GG6SB-25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WBGA-84

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Access Time-Max:

    0.4 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B84

  • Length:

    12.5 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    DDR2 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    84

  • Number of Words:

    67108864 words

  • Number of Words Code:

    64000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Organization:

    64MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

W971GG6SB-25 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the W971GG6SB-25 is -40°C to 85°C.
  • The power-up and power-down sequences for the W971GG6SB-25 should be handled according to the recommended power-up and power-down sequences outlined in the datasheet, ensuring that the voltage supply is stable and within the recommended range.
  • The recommended PCB layout and design considerations for the W971GG6SB-25 include using a 4-layer PCB, placing decoupling capacitors close to the device, and ensuring that the power and ground planes are properly connected.
  • To troubleshoot issues with the W971GG6SB-25, check the power supply voltage, clock frequency, and data bus signals. Verify that the device is properly configured and that the firmware is up-to-date. Use debugging tools and oscilloscopes to analyze the signals and identify the root cause of the issue.
  • The recommended storage and handling procedures for the W971GG6SB-25 include storing the devices in a dry, cool place, away from direct sunlight and moisture. Handle the devices by the edges to prevent damage to the pins, and avoid bending or flexing the leads.

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W971GG6SB-25 Overview

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