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W971GG6SB25I - Winbond

Description: DRAM 1Gb, DDR2-800, x16, Ind temp

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Symbol
W971GG6SB25I - Winbond - PCB symbol
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PCB Footprints
W971GG6SB25I - Winbond PCB footprint - BGA - BGA - WBGA-84
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3D Models
W971GG6SB25I - Winbond - 3D model - BGA - WBGA-84
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W971GG6SB25I Details

  • Manufacturer Part Number:

    W971GG6SB25I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WBGA-84

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Access Time-Max:

    0.4 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B84

  • Length:

    12.5 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    DDR2 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    84

  • Number of Words:

    67108864 words

  • Number of Words Code:

    64000000

  • Operating Mode:

    SYNCHRONOUS

  • Organization:

    64MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

W971GG6SB25I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the W971GG6SB25I is -40°C to 85°C.
  • The power-up and power-down sequences for the W971GG6SB25I should be handled according to the recommended power-up and power-down sequences outlined in the datasheet, which involves a specific sequence of voltage application and removal to ensure proper device operation.
  • The recommended PCB layout and routing for the W971GG6SB25I involves following the guidelines outlined in the datasheet, which includes using a 4-layer PCB, placing decoupling capacitors near the power pins, and using a solid ground plane to minimize noise and ensure signal integrity.
  • To troubleshoot issues with the W971GG6SB25I, start by checking the power supply voltage, clock frequency, and signal integrity. Use oscilloscopes and logic analyzers to debug the issue, and consult the datasheet and application notes for guidance.
  • The W971GG6SB25I is suitable for a wide range of applications, including industrial control systems, medical devices, automotive systems, and consumer electronics, where high-density storage and low power consumption are required.

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W971GG6SB25I Overview

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