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W971GG8NB25I - Winbond

Description: 1Gb DDR2 SDRAM 800MHz VFBGA60

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PCB Footprints
W971GG8NB25I - Winbond PCB footprint - BGA - BGA - VFBGA - 60
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W971GG8NB25I - Winbond  - 3D model - BGA - VFBGA - 60
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W971GG8NB25I Details

  • Manufacturer Part Number:

    W971GG8NB25I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-60

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Clock Frequency-Max (fCLK):

    400 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B60

  • Length:

    9.5 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    DDR2 DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    60

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA60,9X11,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.008 A

  • Supply Current-Max:

    0.14 mA

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

W971GG8NB25I Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the W971GG8NB25I is -40°C to 85°C, but it can also operate in an extended temperature range of -40°C to 105°C with some performance degradation.
  • The power-up sequence should be VCC first, then VPP, and finally CLK. For power-down, the sequence should be reversed: CLK first, then VPP, and finally VCC. This ensures proper device operation and prevents latch-up or damage.
  • The maximum clock frequency supported by the W971GG8NB25I is 166 MHz, but it can operate at lower frequencies depending on the specific application and system requirements.
  • The write and erase operations require specific timing sequences, which can be found in the datasheet. However, as a general guideline, the write operation typically takes around 10-15 μs, and the erase operation takes around 2-3 ms. The exact timing may vary depending on the specific device and system configuration.
  • The status register should be polled regularly during read and write operations to ensure that the device is not busy or in a state that could cause data corruption. The recommended polling frequency is around 100-200 kHz, but this may vary depending on the specific system requirements and performance constraints.

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W971GG8NB25I Overview

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